Transporting apparatus with shock absorbing elements

ABSTRACT

The present disclosure provides a transporting apparatus. The transporting apparatus can include the following components: a first frame support configured to support an object; a second frame support configured to roll the transporting apparatus and to move relative to the first frame support and a plurality of shock absorbing elements positioned between the first frame support and the second frame support.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 16/442,038, filed on Jun. 14, 2019, titled“Transporting Apparatus with Shock. Absorbing Elements,” which claimsthe benefit of U.S. Provisional Patent Application No. 62/712,639,titled “Anti-Chipping Wafer Holder with Suspended Air Cushion,” filedJul. 31, 2018, the disclosures of which are incorporated herein byreference in their entireties.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs where each generation has smaller and more complexcircuits than the previous generation. However, these advances haveincreased the complexity of processing and manufacturing ICs and, forthese advances to be realized, similar developments in IC processing andmanufacturing are needed. In the course of IC evolution, functionaldensity (i.e., the number of interconnected devices per chip area) hasgenerally increased while geometry size (i.e., the smallest component(or line) that can be created using a fabrication process) hasdecreased. This scaling down process generally provides benefits byincreasing production efficiency and lowering associated costs.

As semiconductor manufacturing has grown in complexity, it becomesincreasingly necessary to transport wafers among a number of differentprocess modules or clusters of process modules, and sometimes betweentools and modules that are separated by significant distances. Transportbetween different process facilities often results in increased risk ofwafer damage (e.g., bevel defects, chipping defects, die-shift, crack,and molding loss) due to shock and vibration of the wafer transportingapparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. Inaccordance with the common practice in the industry, various featuresare not drawn to scale. In fact, the dimensions of the various featurescan be arbitrarily increased or reduced for clarity of illustration anddiscussion.

FIG. 1 is a side view of a schematic of a transporting apparatus, inaccordance with some embodiments of the present disclosure.

FIG. 2 is another side view of a schematic of a transporting apparatus,in accordance with some embodiments of the present disclosure.

FIG. 3 is a schematic showing a plurality of shock absorbing elementswith various shapes, in accordance with some embodiments of the presentdisclosure.

FIG. 4 is an illustration of an exemplary computer system in whichvarious embodiments of the present disclosure can be implemented.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over a second feature in the description that followscan include embodiments in which the first and second features areformed in direct contact, and can also include embodiments in whichadditional features are disposed between the first and second features,such that the first and second features are not in direct contact. Inaddition, the present disclosure can repeat reference numerals and/orletters in the various examples. This repetition does not in itselfdictate a relationship between the various embodiments and/orconfigurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper,” and the like, can be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus can be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein can likewise be interpreted accordingly.

10010 The term “nominal” as used herein refers to a desired, or target,value of a characteristic or parameter for a component or a processoperation, set during the design phase of a product or a process,together with a range of values above and/or below the desired value,The range of values can be due to slight variations in manufacturingprocesses or tolerances.

The term “horizontal,” as used herein, means nominally parallel to alevel ground.

The term “vertical,” as used herein, means nominally perpendicular to alevel ground.

The term “substantially” as used herein indicates the value of a givenquantity that can vary based on a particular technology node associatedwith the subject semiconductor device. In some embodiments, based on theparticular technology node, the term “substantially” can indicate avalue of a given quantity that varies within, for example, ±5% of atarget (or intended) value.

The term “about” as used herein indicates the value of a given quantitythat can vary based on a particular technology node associated with thesubject semiconductor device. In some embodiments, based on theparticular technology node, the term “about” can indicate a value of agiven quantity that varies within, for example, 5-30% of the value(e.g., ±5%, ±10%, ±20%, or ±30% of the value).

In semiconductor manufacturing, semiconductor wafers must be safelytransported between processing stations without damaging or destroyingthe wafers. Semiconductor wafers can be retained in a clean roomenvironment during processing to preserve the purity of the layersdeposited on the wafers. For additional protection against contaminants,the semiconductor wafers can be retained in sealed transport containersas they are moved throughout the clean room to minimize any exposure tothe environment outside of the processing stations.

External air entering the cleanroom is filtered to exclude dust, and theair inside the cleanroom is constantly recirculated throughhigh-efficiency particulate air (HEPA) and/or ultra-low particulate air(ULPA) filters to remove internally generated contaminants. Cleanroomsmaintain particulate-free air through the use of either HEPA or ULPA iihers employing laminar or turbulent air flow principles. Laminar, orunidirectional, air flow systems direct filtered air downward or inhorizontal direction in a constant stream towards filters located onwalls near the cleanroom floor and through raised perforated floorpanels to, be recirculated. Turbulent, or non-unidirectional, air flowuses both laminar air flow hoods and nonspecific velocity filters tokeep air in a cleanroom in constant motion, although not all in the samedirection. The rough air seeks to trap particles that may be in the airand drive them towards the perforated floor, where they enter liftersand leave the cleanroom environment.

However, the perforated floor can shock and vibrate a wafer transportingapparatus (e.g., wafer transport trolley, automated material handlingsystems, or automated guided vehicle) that travels on the floor. And theexcessive Shock and vibration can damage wafers, causing beveled edges,chipping defects, die shifts, cracks, and molding losses.

This disclosure is directed to a transporting apparatus that includes afirst frame support, a second frame support, and shock absorbingelements positioned between the first and second frame supports. Thefirst and second frame supports are not in direct contact with eachother, according to some embodiments. The shock absorbing elements serveas an air cushion suspension system to reduce shock and vibration whenthe transporting apparatus moves in the fabrication facility. Suchtransporting apparatus can be integrated into various wafer transportingsystems including, but not limited to, wafer trolleys, automatedmaterial handling systems, and automated guided vehicles.

FIG. 1 is a side view (viewing from the y-direction) of a schematic of atransporting apparatus 100, in accordance with some embodiments of thepresent disclosure. FIG. 2 is a side view (viewing from the x-direction)of a schematic of a transporting apparatus 100, in accordance with someembodiments of the present disclosure. As illustrated in FIG. 1 ,transporting apparatus 100 can include a first frame support 110configured to support an object 150 on a floor surface (e.g., perforatedfloor in a clean room) a second frame support 120 configured to providesupport for first frame support 110 and roll transporting apparatus 100on the floor surface; and a plurality of shock absorbing elements 130positioned between first frame support 110 and second frame support 120.In some embodiments, second frame support 120 can be a rolling framesupport. The rolling frame support can include a plurality of rollers(e.g., wheels or casters) to provide the rolling movement fortransporting apparatus 100 on the floor surface. In some embodiments,first frame support 110 and second frame support 120 are not in directcontact and separated by shock absorbing elements 130. Shockingabsorbing elements 130 can be an elastic material and deform under shockand vibration. Second frame support 120 can be movable relative to firstframe support 110. In some embodiments, transporting apparatus 100 canfurther include a sealed, nitrogen-purged plastic shell to create alow-humidity transport and storage environment.

In some embodiments, first frame support 110 can include a plurality ofV-shaped shelves configured to support an object (e.g., a wafer cassette150). In some embodiments, the object can also be a wafer pod, a frontopening unified pod (FOUP), or any other semiconductor carrier. In someembodiments, the object can be sensitive equipment or devices, such asmedical systems, flat panel displays, and/or computer hardware. EachV-shaped shelf can include two panels: a first panel 112 and a secondpanel 114. In some embodiments, first panel 112 and second panel 114 areconnected to each other and form an angle between the two panels. Theangle can be between about 90 degrees and about 135 degrees about 90degrees, about 100 degrees, about 110 degrees, about 120 degrees, orabout 135 degrees). In some embodiments, the angle can be adjusted basedon the shape of the object to secure the object in position on theV-shaped shelf.

In some embodiments, first panel 112 and second panel 114 can have thesame length. In some embodiments, first panel 112 and second panel 114can have different lengths. In some embodiments, first panel 112 canhave a first length (L₁ in FIG. 1 ) between about 350 mm and about 650mm (e.g., about 350 mm, about 450 mm, about 550 mm, or about 650 mm). Insome embodiments, second panel 114 can have a second length (L₂ in FIG.1 ) between about 250 mm and about 450 mm (e.g., about 250 mm, about 350mm, about 450 mm). In some embodiments, first panel 112 and second panel114 can have the same width (W₁ in FIG. 2 ). In some embodiments, firstpanel 112 and second panel 114 can have a width (W₁ in FIG. 2 ) betweenabout 500 mm and about 800 mm (e.g., about 500 mm, about 600 mm, about700 mm, or about 800 mm).

The V-shaped shelves can be made of materials including, but not limitedto, stainless steel, copper, aluminum, carbon steel, or a combinationthereof. In some embodiments, the surface of the V-shaped shelves has anelectropolished finish to improve the smoothness of the V-shaped shelfsurface to minimize dust trapping during transportation. In someembodiments, the V-shaped shelf is perforated. The diameter of theperforated holes on the perforated V-shaped shelf can be between about 3mm and about 50 mm (e.g., about 3 mm, about 5 mm, about 10 mm, about 20mm, about 30 mm, about 40 mm, or about 50 mm). In some embodiments, theV-shaped shelves have perforated holes with a diameter of about 15 mm tooptimize air flow-through and minimize particle accumulation. In someembodiments, transporting apparatus 100 can include between about oneand about twelve V-shaped shelves (e.g., four V-shape shelves in FIG. 1and six V-shape shelves in FIG. 2 ).

In some embodiments, second frame support 120 can include a plurality ofbars and rods configured to support first frame support 110. In someembodiments, second frame support 120 can further include one or morehandles configured to provide gripping support (e.g., clean roomtechnicians) to move transporting apparatus 100 manually. In someembodiments, second frame support 120 and first frame support 110 arenot in direct contact with each other and separated by shock absorbingelements positioned between the two frame supports. First frame support110 and second frame support 120 can have a gap (e.g., G₁ FIG. 1 )between about 3 mm and about 15 mm (e.g., about 3 mm, about 5 mm, about7 mm, about 9 mm, about 11 mm, about 13 mm, or about 15 mm). In someembodiments, each bar and rod can have a diameter between about 10 mmand about 100 mm (e.g., 20 mm, 40 mm, 60 mm, or 80 mm).

Second frame support 120 can be made of materials including, but notlimited to, stainless steel, copper, aluminum, carbon steel, or acombination thereof. In some embodiments, the surface of second framesupport 120 has an electropolished finish to improve the smoothness ofthe V-shaped shelf surface to minimize dust trapping duringtransportation. In some embodiments, second frame support 120 includesthe same materials as that of first frame support 110. In someembodiments, second frame support 120 includes different materials asthat of first frame support 110.

in some embodiments, second frame support 120 can further include aplurality of rollers 140 configured to roll transferring apparatus 100from a first location to a second location. In some embodiments,plurality of rollers 140 can be, but is not limited to, a plurality ofwheels or a plurality of casters. In some embodiments, plurality ofrollers 140 can provide rolling movements in all directions. In someembodiments, plurality of rollers 140 can include a polymeric materialincluding, but not limited to, polyurethane, polyisoprene,polybutadiene, chloroprene rubber, polychloroprene, neoprene, baypren,butyl rubber, halogenated butyl rubbers, styrene-butadiene rubber,nitrile rubber, ethylene propylene rubber, ethylene propylene dienerubber, epichlorohydrin rubber, polyacrylic rubber, silicone rubber,fluorosilicone rubber, fluoroelastomers, viton, tecnoflon, fluorel, perfluoroelastomers, polyether block amides, chlorosulfonated polyethylene,ethylene-vinyl acetate, or a combination thereof. In some embodiments,plurality of rollers 140 can include a plurality of spring-loadedlocking polyurethane casters to ensure smooth rolling to protect objects(e.g., wafers) during transit In some embodiments, transportingapparatus 100 can include 3, 4, 6, or 8 rollers.

Shock absorbing element 130 can be positioned between first framesupport 110 and second frame support 120. In some embodiments, firstframe support 110 and/or second frame support 120 can have a socketstructure 160 to secure shock absorbing element 130 in place and reducelateral movements between first frame support 110 and second framesupport 120. In some embodiments, socket structure 160 can be made ofmaterials including, but not limited to, stainless steel, copper,aluminum, carbon steel, or a combination thereof. In some embodiments,socket structure 160 can be made of materials including, but not limitedto, polyvinyl alcohol, polyvinyl chloride, polytetrafluoroethylene,polyurethane, polyethylene terephthalate, polyethylene, polystyrene,polypropylene, polycarbonate, or a combination thereof.

In some embodiments, shock absorbing element 130 can include a pluralityof inflatable pneumatic shock absorbing elements. Shock absorbingelement 130 can be a sealed structure with a hollow center. In someembodiments, shock absorbing element 130 can include an air cushionsuspension system. In some embodiments, shock absorbing element 130includes a polymer. The polymer can have a shore hardness from about 5shore 00 to about 90 shore A, from about 20 shore 00 to about 80 shoreA, or from about 40 shore 00 to about 70 shore A.

In some embodiments, shock absorbing element 130 can include a polymericmaterial including, but not limited to, chloroprene rubber, butylrubber, butadiene rubber, ethylene propylene, nitrile rubber,fluorocarbon, hydrogenated nitrile, poly-acrylate, polyurethane,polyisoprene, polybutadiene, chloroprene rubber, polychloroprene,neoprene, baypren, butyl rubber halogenated butyl rubbers,styrene-butadiene rubber, ethylene propylene diene rubber,epichlorohydrin rubber, fluorosilicone rubber, fluoroelastomers, viton,tecnoflon, fluorel, perfluoroelastomers, polyether block amides,chlorosulfonated polyethylene, ethylene-vinyl acetate, or a combinationthereof. In some embodiments, shock absorbing element 130 can include anelastomer. The elastomer is a polymer with viscoelasticity (i.e., bothviscosity and elasticity), weak intermolecular forces, low Young'smodulus, and high tensile strength compared to other materials (e.g.,thermoplastic). Intermolecular forces are forces of attraction andrepulsion between molecules and other neighboring particles. In someembodiments, the intermolecular forces between neighboring particles inshock absorbing element 130 is between about 0.1 and about 1 kcal/mol(e.g.,, about 0.1 kcal/mol about 0.2 kcal/mol, about 0.5 kcal/mol, orabout 1 kcal/mol). Young's modulus is a mechanical property thatmeasures the stiffness of a solid material. It defines the relationshipbetween stress (force per unit area) and strain (proportionaldeformation) in a material in the linear elasticity regime of a uniaxialdeformation. In some embodiments, shock absorbing element 130 can have aYoung's modulus between about 1 and about 10 MPa (e.g., about 1 MPa,about 2 MPa, about 5 MPa, or about 10 MPa). Tensile strength is thecapacity of a material or structure to withstand loads tending toelongate. Tensile, strength is measured by the maximum stress that amaterial can withstand while being stretched or pulled before breaking.In some embodiments, shock absorbing element 130 can have a tensilestrength between about 10 and about 50 MPa (e.g., about 10 MPa, about 20MPa, about 30 MPa, about 40 M Pa, or about 50 MPa). Each monomer thatforms a link of the elastomer can be a compound including carbon,hydrogen, oxygen and silicon. In some embodiments, elastomers can beamorphous polymers maintained above their glass transition temperature,so that considerable molecular reconformation, without breaking ofcovalent bonds, is feasible. At ambient temperatures, shock absorbingelement 130 is thus relatively soft (e.g., with a Young's modulus ofabout 3 MPa) and deformable. In some embodiments, a compressibility ofshock absorbing element 130 ranges from about 1% to about 50%.Compressibility is a measure of a change in volume of shock absorbingelement 130 at a native state to a volume during the transportationprocess. In some embodiments, compressibility is determined based on anequation C=(T₁−T₂)/T₁×100, where C is compressibility, T₁ is a thicknessof a sample experiencing a compressive stress of about 300 g/cm², and T₂is a thickness of the sample experiencing a compressive stress of about1800 g/cm². The thickness measurements are made using constantcompressive stress at a temperature of about 25° C.

FIG. 3 a schematic showing a plurality of shock absorbing elements withvarious shapes, in accordance with some embodiments of the presentdisclosure. Shock absorbing element 130 can include a sphericalcomponent, an elliptical component, a disk shape component, a cubicalcomponent, a conical component, a pyramidal component, a cylindricalcomponent, or a combination thereof In some embodiments, the sphericalcomponent can have a diameter between about 30 mm and about 50 mm (e.g.,about 30 mm, about 40 mm, or about 50 mm). In some embodiments, theconical component can have a diameter between about 30 mm and 50 mm(e.g., about 30 mm, about 40 mm, or about 50 mm) and a height betweenabout 30 mm and 50 mm (e.g., about 30 mm, about 40 mm, or about 50 mm).In some embodiments, the cylindrical component can have a diameterbetween about 30 mm and 50 mm (e.g., about 30 mm, about 40 mm, or about50 mm) and a height between 20 mm and 50 mm (e.g., about 20 mm, about 30mm, about 40 mm, or about 50 mm). In some embodiments, the cubicalcomponent can have a cube side length between 20 mm and 50 mm (e.g.,about 20 mm, about 30 mm, about 40 mm, or about 50 mm).

In some embodiments, shock absorbing element 130 can be a hollow articlewith a gas inside to provide air cushion for improved shock reduction.Shock absorbing element 130 can be filled with air or nitrogen and canhave an internal air pressure between about 11 psi and about 18 psi(e.g., about 11 psi, about 13 psi, about 15 psi, or about 18 psi). Insome embodiments, shock absorbing element 130 is a hollow sphere with anoutside diameter between about 30 mm and about 50 mm (e.g., about 30 mm,about 40 mm, or about 50 mm) and a thickness between about 2 and about10 mm (e.g., about 2 mm, about 4 mm, about 6 mm, about 8 mm, or about 10mm). In some embodiments, shock absorbing element 130 can include aplurality of components with the same or different shapes (e.g., twocylindrical components shock absorbing element 310, a conical componentand a disk shape component shock absorbing element 320, four cylindricalcomponents shock absorbing element 330, and stacked cubical componentsshock absorbing element 340).

In some embodiments, transporting apparatus 100 can further include RFIDreading devices and a display located on transporting apparatus 100(e.g., on second frame support 120). Each of the objects t e.g., wafercassette 150 in FIG. 1 ) can be equipped with an RFID tag device thatcommunicates via Wi-Fi with the RFID reading devices on transportingapparatus 100. The display on transporting apparatus 100 displays the IDand the destination of the objects being transported. Such informationcan be sent via Wi-Fi to track the location and status of the objectsbeing transferred by transporting apparatus 100.

In some embodiments, transporting apparatus 100 can be an automatedtransporting apparatus powered by power of various forms, such as DCcurrent, AC current, battery, etc. Transporting apparatus 100 caninclude: a first frame support configured to support an object on afloor surface; a second frame support configured to provide rollingmovement of the transporting apparatus on the floor surface, in whichthe second frame support moves relative to the first frame support; aplurality of shock absorbing elements positioned between the first framesupport and the second frame support; a robotic arm configured to loadand unload the object (e.g., wafer cassette 150 in FIG. 1 ); anidentification (ID) sensing device configured, to read RFID taginformation on the object; and a control unit that controls variousoperations of transporting apparatus 100. For example, the control unitcan control the communication between transporting apparatus 100 and acentral controller, the automated loading and unloading of the object(e.g., wafer cassette 150 in FIG. 1 ), the robotic arm, the detection ofID signals by ID sensing device, the transmission and processing of thesensed ID signals, or any combination thereof.

The control unit can include suitable software and hardware, such ascomputer programs stored in a memory, and a processor and relatedcircuitry, to execute various operations. In some embodiments,transporting apparatus 100 stores a map of the fabrication facility andis installed with suitable positioning systems, so that transportingapparatus 190 can move in the fabrication facility based on designatedroutes. For example, the control unit of transporting apparatus 100 caninclude a global positioning system (GPS) receiver, a receivingdevice/program with a Bluetooth-based indoor positioning system, and/ora receiving device/program with a Wi-Fart-based indoor positioningsystem for navigating in the fabrication facility according to theindoor map. The fabrication facility can include corresponding devicesfor the indoor positioning system, such as Bluetooth beacons and/orWi-Fi access points distributed at various locations for the indoorpositioning functions. The control unit can be arranged at any suitableposition of transporting apparatus 100. In some embodiments, the controlunit is positioned on second frame support 120.

The central controller can include any suitable computer system thatcontrols the overall operation of transporting apparatus 100 andreceiving devices (e.g., tablet and cell phone) The receiving devicescan include any suitable portable device and can be used forcommunication with central controller. In some embodiments, eachreceiving device includes a processor and related circuitry forprocessing and responding to the notifications/commands transmitted bythe central controller. For example, central controller can receivereal-time data from transporting apparatus 100 and transmitnotifications including the real-time status of transporting apparatus100 to the receiving device. Both transporting apparatus 100 andreceiving devices can communicate with the central controller throughcommunication network communication network can be a suitable wired orwireless communication means. In some embodiments, communicationnetworks include Wi-Fi.

FIG. 4 is an illustration of an exemplary computer system 400 in whichvarious embodiments of the present disclosure can be implemented,according to some embodiments. Computer system can be used in thecontrol unit of the transporting apparatus, the RFID tag of the wafercassette, the receiving devices, and the central controller, asdescribed above. Computer system 400 can be any well-known computercapable of performing the functions and operations described herein. Forexample, and without limitation, computer system 400 can be capable ofprocessing and transmitting signals. Computer system 400 can be used,for example, to execute one or more functions of the transportingapparatus.

Computer system 400 can include one or more processors (also calledcentral processing units, or CPUs), such as a processor 404. Processor404 is connected to a communication infrastructure or bus 406. Computersystem 400 also includes input/output device(s) 403, such as monitors,keyboards, pointing devices, etc., that communicate with communicationinfrastructure or bus 406 through input/output interface(s) 402.Computer system 400 can receive instructions to implement functions andoperations described herein e.g., functions of the transportingapparatus—via input/output device(s) 403. Computer system 400 alsoincludes a main or primary memory 408, such as random access memory(RAM). Main memory 408 can include one or more levels of cache. Mainmemory 408 has stored therein control logic (e.g., computer software)and/or data. In some embodiments, the control logic e.g., computersoftware) and/or data can include one or more of the functions describedabove with respect to the container.

Computer system 400 can also include one or more secondary storagedevices or memory 410, Secondary memory 410 can include, for example, ahard disk drive 412 and/or removable storage device or drive 414.Removable storage drive 414 can be a floppy disk drive, a magnetic tapedrive, a compact disk drive, an optical storage device, tape backupdevice, and or any other storage device/drive.

Removable storage drive 414 can interact with a removable storage unit418. Removable storage unit 418 includes a computer usable or readablestorage device having stored thereon computer software (control logic)and/or data. Removable storage unit 418 can be a floppy disk, magnetictape, compact disk, DVD, optical storage disk, and/any other computerdata storage device. Removable storage drive 414 reads from and/orwrites to removable storage unit 418 in a well-known manner.

According to some embodiments, secondary memory 410 can include othermeans, instrumentalities or other approaches for allowing computerprograms and/or other instructions and/or data to be accessed bycomputer system 400. Such means, instrumentalities or other approachescan include, for example, a removable storage unit 422 and an interface420. Examples of the removable storage unit 422 and the interface 420can include a program cartridge and cartridge interface (such as thatfound in video game devices), a removable memory chip (such as an EPROMor PROM) and associated socket, a memory stick and USB port, a memorycard and associated memory card slot, and/or any other removable storageunit and associated interface. In some embodiments, secondary memory410, removable storage unit 418, and/or removable storage unit 422 caninclude one or more of the functions described above with respect to thetransporting apparatus.

Computer system 400 can further include a communication or networkinterface 424. Communication interface 424 enables computer system 400to communicate and interact with any combination of remote devices,remote networks, remote entities, etc. (individually and collectivelyreferenced by reference number 428). For example, communicationinterface 424 can allow computer system 400 to communicate with element428 (remote device(s), network(s), entity(ies) 428) over communicationspath 426, which can be wired and/or wireless, and which can include anycombination of LANs, WANs, the Internet, etc. Control logic and/or datacan be transmitted to and from computer system 400 via communicationpath 426.

The functions/operations in the preceding embodiments can be implementedin a wide variety of configurations and architectures. Therefore, someor all of the operations in the preceding embodiments—e.g., functions ofthe transporting apparatus and the central controller—can be performedin hardware, in software or both. In some embodiments, a tangibleapparatus or article of manufacture including a tangible computeruseable or readable medium having control logic (software) storedthereon is also referred to herein as a computer program product orprogram storage device. This includes, but is not limited to, computersystem 400. main memory 408, secondary memory 410 and removable storageunits 418 and 422, as well as tangible articles of manufacture embodyingany combination of the foregoing. Such control logic, when executed byone or more data processing devices (such as computer system 400),causes such data processing devices to operate as described herein. Insome embodiments, computer system 400 includes hardware/equipment forthe manufacturing of semiconductor wafer and circuit fabrication. Forexample, the hardware/equipment can be connected to or be part ofelement 428 (remote device(s), network(s), entity(ies) 428) of computersystem 400.

This disclosure is directed to a transporting apparatus that includes afirst and a second frame supports and shock absorbing elementspositioned between the two frame supports. The first and second framesupport are not in direct contact with each other. The shock absorbingelements serve as an air cushion suspension system to reduce shock andvibration when the transporting apparatus is in a movement.

Various embodiments in accordance with the present disclosure provide atransporting apparatus, including: a first frame support configured tosupport an object; a second frame support configured to roll thetransporting apparatus and to move relative to the first frame support;and a plurality of shock absorbing elements positioned between the firstframe support and the second frame support.

In some embodiments, a transporting apparatus provided by the presentdisclosure includes a first frame support configured to support anobject, a second frame support configured to support the first framesupport and to move relative to the first frame support; and a pluralityof shock absorbing elements positioned between the first frame supportand the second frame support. In some embodiments, the first and secondframe supports include a gap between the two frame supports.

In some embodiments, a transporting apparatus provided by the presentdisclosure includes a first frame support comprising a plurality ofV-shaped shelves configured to support an object; a second frame supportcomprising a plurality of wheels configured to move the transportingapparatus from a first location to a second location; and a plurality ofshock absorbing elements positioned between the first frame support andthe second frame support.

It is to be appreciated that the Detailed Description section, and notthe Abstract of the Disclosure, is intended to be used to interpret theclaims. The Abstract of the Disclosure section can set forth one or morebut not all exemplary embodiments contemplated and thus, are notintended to be limiting to the subjoined claims.

The foregoing disclosure outlines features of several embodiments sothat those skilled in the art can better understand the aspects of thepresent disclosure. Those skilled in the art will appreciate that theycan readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art will also realize that suchequivalent constructions do not depart from the spirit and scope of thepresent disclosure, and that they can make various changes,substitutions, and alterations herein without departing from the spiritand scope of the subjoined claims.

What is claimed:
 1. A transporting apparatus, comprising: a first framesupport comprising a V-shaped shelf configured to support an object; asecond frame support configured to support the first frame support androll the transporting apparatus, wherein the second frame supportcomprises a first vertical portion and a second vertical portionseparated from the first vertical portion; and a plurality of shockabsorbing elements positioned between the V-shaped shelf and the firstand second vertical portions, wherein the plurality of shock absorbingelements are in direct contact with end portions of the V-shaped shelf.2. The transporting apparatus of claim 1, wherein the first and secondvertical portions are configured to support the end portions of theV-shaped shelf.
 3. The transporting apparatus of claim 1, wherein eachof the plurality of shock absorbing elements comprises a polymer.
 4. Thetransporting apparatus of claim 3, wherein the polymer compriseschloroprene rubber, butyl rubber, butadiene rubber, ethylene propylene,nitrite rubber, fluorocarbon, hydrogenated nitrite, poly-acrylate,silicone, or a combination thereof.
 5. The transporting apparatus ofclaim l, wherein the polymer has a shore hardness from about 5 shore 00to about 90 shore A.
 6. The transporting apparatus, of claim 1, whereineach of the plurality of shock absorbing elements comprises a sphericalcomponent, an elliptical component, a disk shape component, a cubicalcomponent, a conical component, a pyramidal component, a cylindricalcomponent, or a combination thereof.
 7. The transporting apparatus ofclaim 1, wherein each of the plurality of shock absorbing elementscomprises a hollow element with a gas inside.
 8. The transportingapparatus of claim 7, wherein the gas comprises air with a pressurebetween about 11 psi and about 18 psi.
 9. The transporting apparatus ofclaim 1, wherein each of the plurality of shock absorbing elementscomprises a hollow sphere with an outside diameter between about 30 mmand about 50 mm and a thickness between about 2 mm and about 10 mm. 10.The transporting apparatus of claim 1, further comprising: a firstsocket structure attached to the first vertical portion of the secondframe support, wherein the first socket structure is configured to holda first shock absorbing element of the plurality of shock absorbingelements; and a second socket structure attached to the second verticalportion of the second frame support, wherein the second socket structureis configured to hold a second Shock absorbing element of the pluralityof shock absorbing elements.
 11. A transporting apparatus, comprising: afirst frame support comprising first and second panels connected to eachother at an angle, wherein the first frame support is configured tosupport an object with the first panel and the second panel; a secondframe support comprising first and second vertical portions separatedfrom each other, wherein the first vertical portion is configured tosupport the first panel and the second vertical portion is configured tosupport the second panel; a first shock absorbing element positionedbetween the first vertical portion and the first panel; and a secondshock absorbing element, positioned between the second vertical portionand the second panel.
 12. The transporting apparatus of claim 11,further comprising a plurality of rollers connected to the second framesupport and configured to roll the transporting apparatus.
 13. Thetransporting apparatus of claim 11, wherein a gap between the firstpanel and the first vertical portion ranges from about 3 mm to about 15mm.
 14. The transporting apparatus of claim 11, further comprising: afirst socket structure attached to the first vertical portion of thesecond frame support and configured to hold the first shock absorbingelement; and a second socket structure attached to the second verticalportion of the second frame support and configured to hold the secondshock absorbing element.
 15. A transporting apparatus, comprising: afirst frame support comprising a plurality of V-shaped shelvesconfigured to support an object, wherein each of the plurality ofV-shaped shelves comprises a first end portion and a second end portionopposite to the first end portion; a second frame support configured tosupport the first frame and separated from the first frame support byfirst and second absorbing elements, wherein: the second frame supportcomprises first and second vertical portions separated from each other,the first shock absorbing element is positioned between the firstvertical portion and the first end portion of the V-shaped shelves, andthe second shock absorbing element is positioned between the secondvertical portion and the second end portion of the V-shaped shelves; afirst socket structure attached to the first vertical portion andconfigured to hold the first shock absorbing element; and a secondsocket structure attached to the second vertical portion and configuredto hold the second shock absorbing element.
 16. The transportingapparatus of claim 15, wherein each of the plurality of V-shaped shelvescomprises stainless steel, copper, aluminum, carbon steel, or acombination thereof.
 17. The transporting apparatus of claim 15, whereineach of the plurality of V-shaped shelves comprises a first panelconnected to a second panel at an amide between about 90 degrees andabout 135 degrees.
 18. The transporting apparatus of claim 17, whereinthe first panel has a first length between about 350 mm and about 650mm, and the second panel has a second length between about 250 mm andabout 450 mm.
 19. The transporting apparatus of claim 15, wherein eachof the first and second shock absorbing elements comprises an aircushion suspension system.
 20. The transporting apparatus of claim 15,wherein each of the first and second socket structures comprisesstainless steel, copper, aluminum, carbon steel, or a combinationthereof.